Join Radrock and you will enjoy
Core world, new life
Core world, new life
Radrock is committed to becoming China's largest supplier of RF front-end chips, building the strongest Chinese core, and striving to become an industry-leading enterprise, creating value for society through technological innovation.
Broad development platform
Broad development platform
Internal training and internal promotion allow outstanding talents to stand out. There are both management and professional development channels, and the platform is broader.
Open and inclusive office culture
Open and inclusive office culture
At Radrock, we encourage prosperity and continuous innovation; encourage risk-taking and tolerate failure; advocate competition, equality and openness; pay attention to cooperation and people-oriented. We believe that every star will shine here.
People-oriented
People-oriented
Talent is our only capital, and we believe that the harder you work, the luckier you are. Team travel, fitness exercises, daily afternoon tea, equity incentives..., more benefits are determined by you, and all your contributions can be rewarded.
Social recruitment
NPI
Number of recruits: 2
2020.06.30
Work location: Shenzhen

Job Responsibilities
1. Responsible for the confirmation of the project status and the preparation of the materials when the production is introduced in the early stage of trial production, and the technical status and technical documents of the R&D confirmation project, and preparing for the trial production;
2. Support the gradual introduction of new products to ensure risk assessment and control during the import process;
3. Follow up the product project plan, engineering schedule, test schedule, reliability results and mass production introduction;
4. Follow up the trial production progress and the problems that occur during the process, propose improvement plans, and finally ensure the project progress and shorten the project sample cycle;
5. Responsible for the summary of trial production, and collaborate with other functional departments to complete the process of vector production conversion of engineering samples;
6. Familiar with IC product reliability process, can analyze and improve product reliability anomalies.
7. Lead the introduction of the second supplier of products.
8. Keep abreast of the latest packaging technology and choose the best and most reliable packaging solutions, materials and suppliers in combination with different product characteristics;

Job Requirements
1. Bachelor degree or above;
2. Familiar with the packaging and testing process of IC products, with the ability to find and solve problems in the packaging and testing production process, RF products are preferred, and have a certain understanding of product packaging forms, basic forms and applications;
3. Familiar with IC product reliability testing standards and methods;
4. Understand the reliability testing process of new product verification and mass production monitoring (ORT)
5. More than 5 years of experience as an NPI engineer or packaging process engineer.
6. Understand quality tools such as SPC, 6 sigma, DFM, etc.

Please send your resume to this email: joy.shi@radrocktech.com
SQE
Number of recruits: 2
2020.06.30
Work location: Shenzhen

Job Responsibilities
1. Control the risks of each stage from design to wafer manufacturing, packaging, testing, reliability and mass production ramping, and formulate corresponding measures to ensure product quality and reliability;
2. Risk management and control of the project, monitoring of important parameters of the production line (manufacturing, testing, packaging stages), continuous process improvement and subsequent reliability monitoring;
3. Make chip-level, module-level, board-level and finished-level reliability strategies for products, and be responsible for the specific implementation of subsequent reliability engineering.
4. Prepare quality control documents.

Job Requirements
1. Education major: Bachelor degree or above, graduate student is preferred, semiconductor/microelectronics/electronic and electrical engineering/communication engineering major is preferred.
2. Work experience: more than 3 years working experience in product quality assurance, reliability engineering and failure analysis.
3. Knowledge and skills:
a. Familiar with board-level, finished-level and wafer-level reliability tests;
b. Familiar with various methods of failure analysis, familiar with product yield improvement and customer return RMA process;
c. Familiar with the development process of the chip, familiar with the principles of semiconductor devices, process, packaging and testing.
d. Experience in leading packaging and testing factories in China is preferred.

Please send your resume to this email: joy.shi@radrocktech.com
Test Engineer
Number of recruits: 2
2020.06.30
Work location: Shenzhen

Job Responsibilities
1. Responsible for the daily maintenance and software development of laboratory test instruments and systems;
2. Test the chip according to the test tasks formulated by R&D, including routine test, stability test, noise test, aging test, etc., and form a test report;
3. Build a test platform according to the needs of the test, and debug and analyze the abnormal conditions during the test;
4. Assist in the introduction and debugging of the chip mass production stage, and travel to the factory for system debugging and supervision according to the needs of the situation.

Job Requirements
1. The working period is more than 3 years;
2. Bachelor degree or above, major in electronic engineering;
3. Familiar with the principle of radio frequency communication, master the operation and principle of radio frequency test instruments, including KEYSIGHT signal source, spectrum analyzer and network analyzer;
4. Have relevant working experience in chip testing;
5. With programming experience, familiar with LabVIEW/C/C++/.NET/Matlab and other programming languages

Please send your resume to this email: joy.shi@radrocktech.com
FAE
Number of recruits: 4
2020.06.30
Work place: Shenzhen, Shanghai

Job Responsibilities
1. Responsible for customer project technical support (RF modem configuration, matching debugging and PA load optimization);
2. Solve customer-related technical and quality issues, and feedback customers' technical needs;
3. Cooperate with sales and R&D to complete customer project design in and follow up project status;

Job Requirements
1. Bachelor degree or above, major in communication and electronics;
2. More than three years of experience in RF design and debugging of mobile phones, modules and smart watches;
3. Familiar with the communication principles of GSM, WCDMA, LTE, and 3gpp radio frequency indicators;
4. Familiar with the operation of the comprehensive tester CMW500, AG8960, MT8820, VNA, SPA and other instruments;
5. Have platform hardware debugging experience, such as Qualcomm, MTK, Spreadtrum, ZTE Micro and ASR, familiar with related platform RF modem configuration is preferred.

Please send your resume to this email: joy.shi@radrocktech.com
Analog Circuit Design Engineer
Number of recruits: 4
2020.06.30
Work location: Shenzhen

Job Responsibilities
1. Participate in the research and development of new products as a circuit design engineer, including circuit design, simulation, etc.;
2. Guide layout work to ensure layout quality;
3. Complete the product development documents;
4. Participate in product testing and DEBUG.

Job Requirements
1. Master degree or above, major in analog or radio frequency microelectronics;
2. More than three years of relevant working experience in analog circuit design;
3. Proficiency in basic knowledge of analog circuits, experience in independently designing modules such as Bandgap, OPAMP, AD/DA, LDO is preferred, experience in SOI design is preferred, and experience in mass production is preferred;
4. Proficiency in cadence design environment, proficiency in ADS and HFSS experience is preferred;
5. Good communication skills and team spirit, love technology, willing to innovate, proficient in reading English technical documents.

Please send your resume to this email: joy.shi@radrocktech.com
RF Engineer
Number of recruits: 10
2020.06.30
Work place: Shenzhen, Shanghai

Job Responsibilities
1. RF module design, including R&D of terminal RF module products such as 2G, WCDMA, LTE, LTE+, and 5G C-Band;
2. RF power amplifier chip design, mainly including gallium arsenide HBT, gallium nitride and other chip designs.

Job Requirements
1. 25-35 years old, male or female;
2. Bachelor degree or above (inclusive), major in electronic engineering, microwave radio frequency;
3. Solid RF foundation, familiar with RF matching design and RF filter design;
4. Experience in electromagnetic simulation is preferred;
5. Those with active circuit design experience are preferred, such as RF power amplifier, low noise amplifier, etc.;
6. Proficiency in HFSS and EM simulation, familiar with ADS, Cadence PCB and other design software;
7. Familiar with RF test equipment, such as signal source, spectrum analyzer, network analyzer, etc.;
8. Being conscientious and responsible, with strong sense of responsibility and strong professionalism;
9. Have team spirit and can work under pressure.

Please send your resume to this email: joy.shi@radrocktech.com
RF IC Engineer
Number of recruits: 9
2020.06.30
Work place: Shenzhen, Shanghai

Job Responsibilities
1. Responsible for the design of LNA, Switch, PA and other RF circuits and modules based on CMOS/SOI process;
2. Responsible for RF device and circuit layout design and post-imitation and packaging simulation verification, participating in RF device modeling and material design;
3. Responsible for test verification and laboratory debugging of RF circuits and modules;
4. Write product manuals, application documents, etc.

Job Requirements
1. Graduate degree or above, semiconductor physics and microelectronics and other related majors;
2. Familiar with related knowledge of microwave radio frequency/electromagnetic field, analog circuit, signal and system, communication system;
3. Familiar with the semiconductor (CMOS/SOI/GaAs/SiGe, etc.) process;
4. Skilled use of design tools such as ADS, Cadence and HFSS and common test equipment, strong layout design experience and circuit test analysis ability;
5. Outstanding hands-on and active learning ability, good communication/teamwork ability;
6. Those with the following experience are preferred:
a. Have complete PA Module/LNA/Switch product development experience;
b. Proficient in laboratory test equipment operation and process;
c. Familiar with semiconductor devices, materials and processes;
d. Familiar with passive device design.

Please send your resume to this email: joy.shi@radrocktech.com
RF System Engineer
Number of recruits: 2
2020.06.30
Work location: Shenzhen

Job Responsibilities
1. Responsible for the research and design of mobile phone RF new circuit system and architecture;
2. Responsible for defining the indicators of each module of the mobile phone radio frequency link and performing link calculation;
3. Create a design and verification strategy for the mobile phone RF system;
4. Test and verification of RF chip implementation (according to mobile phone RF system requirements and 3GPP requirements)
5. Based on the feedback from the designer, review the system specification trade-offs;
6. Analyze and find out the key bottlenecks in the circuit system design.

Job Requirements
1. Master degree or above in microwave electronics, electronic engineering, computer science or related majors;
2. Work experience in mobile phone company (HOVM) and 3 years or more;
3. Understand the indicators of each module of the RF link such as LNA, PA, Filter, VGA, MIXER, VCO, PLL;
4. Calculate RF link performance, including RF gain/power budget, cascade noise analysis, linear performance, frequency planning, power consumption, control functions, etc.
5. Have a strong teamwork spirit and can communicate with the design team efficiently to ensure high-quality completion of the work.

Please send your resume to this email: joy.shi@radrocktech.com
Test Engineer (factory)
Number of recruits: 2
2020.06.30
Work location: Ningbo, Yuyao, Wuxi

Job Responsibilities
1. Responsible for the construction, maintenance and debugging of the mass production test system in the packaging and testing factory;
2. Responsible for test monitoring and data analysis statistics of mass production chips;
3. Responsible for the daily maintenance of the test, including calibration, troubleshooting, etc.;
4. Timely feedback the problems in the testing process to provide data for the R&D and operation departments;
5. Responsible for guiding the technical personnel of the packaging and testing plant to be familiar with the testing process and steps;
6. Familiar with packaging process (LGA FC QFN).

Job Requirements
1. The working period is about 5 years;
2. College degree or above, major in electronic engineering;
3. Familiar with the principle of radio frequency communication, master the operation and principle of radio frequency test instruments, including KEYSIGHT signal source, spectrum analyzer and network analyzer;
4. Have experience in debugging and supporting chip mass production test system;
5. Those with programming experience are preferred.

Please send your resume to this email: joy.shi@radrocktech.com
HR administrative specialist
Number of recruits: 1
2020.07.03
Work location: Shanghai

Job Responsibilities
1. Responsible for the handling of the company's daily administrative affairs (courier delivery, employee meal supplement statistics, office supplies procurement, afternoon refreshment preparation), etc.;
2. Responsible for employee settlement, social security and provident fund handling and salary payment;
3. Implement and implement relevant systems such as recruitment, training, compensation and benefits, and employee incentives;
4. Personnel files and labor relationship management of company employees;
5. Complete other transactional work handed over by superiors.

Job Requirements
1. College degree or above, major is not limited, more than 1 year working experience in personnel administration;
2. Familiar with the relevant knowledge of labor law, skilled operation of office software, EXCEL simple function formula use;
3. Careful, serious, responsible, lively and cheerful personality, optimistic and positive working attitude;
4. Have a strong sense of service and teamwork spirit, willing to take the initiative to work and work carefully;
5. Good communication and coordination ability, adaptability and execution ability.

Please send your resume to this email: joy.shi@radrocktech.com
PM
Number of recruits: 1
2020.07.03
Work location: Shenzhen

Job Responsibilities
1. Participate in assisting and following up the project progress, communicating and coordinating various details in the product development process;
2. Participate in the coordination of the market operation preparation work before the product goes online, including the final version data of the preliminary development materials;
3. Collect and feedback customers' opinions on products in a timely manner, and arrange product optimization plans;

Job Requirements
1. Bachelor degree or above, about 5 years of experience as an NPI engineer or packaging process engineer;
2. Familiar with the packaging and testing process of IC products, with the ability to find and solve problems in the packaging and testing production process, RF products are preferred, and have a certain understanding of product packaging forms, basic forms and applications;
3. Familiar with IC product reliability testing standards and methods;
4. Understand the reliability testing process of new product verification and mass production monitoring (ORT). ​​​​​​

Please send your resume to this email: joy.shi@radrocktech.com